2020/05/25 先進半導體封裝-SiP和異質多元整合封裝的新方法–氣溶膠噴射(Aerosol Jet)解決方案 The new approach to SiP and heterogeneous integration – aerosol jet solution




5/25 (一) 
The new approach to SiP and heterogeneous integration – aerosol jet solution
先進半導體封裝-SiP和異質多元整合封裝的新方法–氣溶膠噴射(Aerosol Jet)解決方案

Topic I:  Integrating Aerosol Jet Solutions into Your Printed Electronics R&D and Production (English全英文演講,沒有翻譯)
Speaker:Dr. Sampan Seth - Head of Applications | Optomec Asia Pacific
Time: 10:30~11:10 AM
 
Description: 
  • Aerosol Jet general introduction – fast, accurate and affordable.
  • Aerosol jet series system and service –  a disruptive technology for rapid manufacturing.
  • How businesses are using aerosol jet to their advantage.
  • How Optomec can help you find the right printed electronic solution for your business.

Topic II: Advanced Semiconductor Packaging of wafer level packaging (WLP) printed by aerosol jet solution (Chinese , 中文演講)
Speaker:Dr. Peter Chiu 邱雲堯博士
Time: 11:10~11:40 AM

Description: 
  • Printed electronics (PE) solution – industrial capabilities, versatility, accuracy and ease of use.
  • A new approach to SiP and heterogeneous integration.
  • Ink & substrate parameter scenario.
  • Pros and cons of printed electronics and lithography
  • Trend of flexible IC fabs setup in the market.

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