The new approach to SiP and heterogeneous integration – aerosol jet solution
2020/05/25 先進半導體封裝-SiP和異質多元整合封裝的新方法–氣溶膠噴射(Aerosol Jet)解決方案 The new approach to SiP and heterogeneous integration – aerosol jet solution
Integrating Aerosol Jet Solutions into Your Printed Electronics R&D and Production (English全英文演講，沒有翻譯)
Speaker：Dr. Sampan Seth - Head of Applications | Optomec Asia Pacific
Time: 10:30~11:10 AM
Topic II: Advanced Semiconductor Packaging of wafer level packaging (WLP) printed by aerosol jet solution (Chinese , 中文演講)
Speaker：Dr. Peter Chiu 邱雲堯博士
Time: 11:10~11:40 AM
- Aerosol Jet general introduction – fast, accurate and affordable.
- Aerosol jet series system and service – a disruptive technology for rapid manufacturing.
- How businesses are using aerosol jet to their advantage.
- How Optomec can help you find the right printed electronic solution for your business.
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- Printed electronics (PE) solution – industrial capabilities, versatility, accuracy and ease of use.
- A new approach to SiP and heterogeneous integration.
- Ink & substrate parameter scenario.
- Pros and cons of printed electronics and lithography
- Trend of flexible IC fabs setup in the market.