•High-intensity flashlamp source

                    •Light absorber converts light energy into thermal energy

                    •Sub-millisecond debond pulse duration

                    •Debond entire 150 mm wafer with one pulse

                    •No ash or residue

 

 

 

 

                   

                   •High-intensity flashlamps to debond

                   •Lower processing cost per wafer by at least 30% compared to  laser debond

                   •Cleaner debonding process – no ash or residue

                   •Significant reduction in cleaning efforts (financial benefit is not reflected in the 30%  lower TCO)

                   •Reusable carriers

                   •Compatible with warped substrates with significant hardware changes